For the Bump and solder balls of the lead-free process, the probes that have been used for a long time have a shortened life due to solder adhesion, and the operating cost is high.
The company provides countermeasures for lead-free processes and proposes various probes for customers. Representative products have "hard plating" that increases the hardness of the original gold plating.
"Gold" and the "alloy" developed by Jingyan. Compared with the original product, the wear resistance and contact resistance are relatively stable, and the ability to prevent solder adhesion is improved.
The picture shows the comparison of the impedance values of the original gold-plated probe and the alloy probe.
The X axis is the number of Contacts (up to 200K)
Y-axis is the change in impedance value
