Applicable: high frequency components of various packaging methods such as CSP, QFN, QFP, LGA, etc.
Description:
By changing the shape of the needle and surface treatment, the probe has the advantages of stable signal transmission and no limitation of probe configuration in terms of LGA, BGA and other package method tests. However, when the bandwidth is more than a certain level, the test of the high-frequency component may also have serious drawbacks. Therefore, Seiko is able to maintain the appearance of the probe so that it is not easily deformed by the unique precision machining and assembly technology, and has achieved an ultra-short length of 1.5 mm probe that could not be achieved before. For the world, we maintain the possibility of testing the high-frequency components of the general probe type Test Socket application.
