kelvin Probe Card | Taiwan's most professional semiconductor leading brand - Seiken Micro Technology Co., Ltd.
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Applicable: WLCSP probe card, CSP, BGA, QFN and other packaging methods Test Socket
Description:
With the Kelvin probe card of the traditional probe, the needle spacing of Force and Sense cannot be shortened, causing the tip of the needle to slip on the solder ball, and the tip of the needle is not in the center of the Pad, so stable contact cannot be obtained.
The new Kelvin probe card can be used to reduce the pitch of the tip to 60um according to the traditional probe method; in addition, it can be stably contacted for very small bumps and pads.
Not only the pointer to the probe card, but also the Test Socket. It can measure Kelvin of various components such as CSP, BGA and QFN, and Min. Pitch can reach 0.3 mm.
