Applicable: WL-CSP, FLIPCHIP probe card
In the WLCSP and FLIPCHIP tests, the contact technology of solder balls accumulated by Test Socket for many years was applied to the production of probe cards. Reliable testing is achieved by using the unique advanced plating technology and alloy materials to prevent solder adhesion. Make sure that it is suitable for small spacing of "Area Array 150um". Moreover, it is possible to perform not only single point contact but also Kelvin contact. Through the application of Test Socket design and the expertise of the probe manufacturer to meet the various needs of customers.