From small desktop panels to floor-mounted small and medium-sized panel testers, we can produce a wide range of products according to customer needs. In addition, in addition to the panel machine, we can also contact us regarding the test machine for the substrate and components.

Compared with the current TCP and COF inspection probe cards, it is easier to respond to Multi DUT products, and each needle can be replaced individually to reduce operating costs.

As the performance of the wafer increases, the pitch of the Pad becomes smaller and smaller, and the refined Micro Cube probe card ensures stable contact. The unique contact pin and ultra-fine processing technology ensure a small pitch of "45um".

In the WLCSP and FLIPCHIP tests, the contact technology of solder balls accumulated by Test Socket for many years was applied to the production of probe cards. Reliable testing is achieved by using the unique advanced plating technology and alloy materials to prevent solder adhesion.

With the Kelvin probe card of the traditional probe, the needle spacing of Force and Sense cannot be shortened, causing the tip of the needle to slip on the solder ball, and the tip of the needle is not in the center of the Pad, so stable contact cannot be obtained.

For lead-free solder balls, the use of original advanced coating technology and alloys prevents solder adhesion for reliable testing. Moreover, it is possible to perform not only single point contact but also Kelvin contact.

採用具有獨創構造的Tubeless探針，適用於150um窄小間距。Tubeless探針採用無套筒彈簧的獨創構造，可適用於高密度的測試頭。另外，經由採用獨創的彈簧，不僅可適用於小間距，同時可實現100萬次的耐用壽命。

經由改變針頭形狀和表面處理，使得探針在LGA、BGA等封裝方式測試方面，有穩定信號傳輸及沒有限制探針配置的優點。

2019/01/28

展覽活動期間：2018.09.05 - 2018.09.07 展覽活動地點：一樓展場、雲端展場 展覽主辦單位：美商國際半導體產業有限公司台灣分公司

2019/01/28

半導體設備零組件國產化專區 經濟部工業局致力於推動國內半導體設備產業升級，委由金屬中心執行「先進封裝設備計畫」，聯合工業技術研究院提供半導體設備產業後勤支援，從引進設備外商在台投資及建立供應鏈，到整合產、研開發關鍵零組件、整機設備聯盟、引進國際技術合作，並且提供先期驗證及測試服務，協助國內零組件廠滿足客戶品質需求，加速產品進入客戶產線時程，經過長期耕耘已成功推廣至國內晶圓廠、封裝廠及系統廠。 為推廣計畫執行成果並強化國內產品市場能見度，將結合「SEMICON Taiwan」展覽舉行成果發表，於107年9月5至7日假台北南港展覽館1樓K2276攤位展出，在此誠摯地邀請業界先進蒞臨指導。 金屬中心「半導體設備零組件國產化專區」自2015年起整合輔導廠商展現國內半導體設備零組件量能，於專區展示多項關鍵產品，獲得各界迴響；今年亦將延續往年呈現形式，合展廠商有華谷電機股份有限公司、印能科技股份有限公司、名超企業股份有限公司及馗鼎奈米科技股份有限公司，將展出多樣重要產業技術，金屬中心希望藉由多角度的產業分析以及技術研發服務，讓國內外買主深入了解台灣半導體設備零組件的量能。