The company provides countermeasures for lead-free processes and proposes various probes for customers. Representative products include "hard gold plating" that increases the hardness of the original gold plating, and "alloy" developed by Jingyan. Compared with the original product, the wear resistance and contact resistance are relatively stable, and the ability to prevent solder adhesion is improved.

As the performance of the wafer increases, the pitch of the Pad becomes smaller and smaller, and the refined Micro Cube probe card ensures stable contact. The unique contact pin and ultra-fine processing technology ensure a small pitch of "45um".

In order to ensure the reliability of electronic components, high-precision probes are indispensable for narrowing the pin diameter of electronic components.
The company's precision machining and assembly technology enables the production of 80umPitch probes.
1. For the purpose of Fine Pitch, shorten the outer diameter to 50um.
2. As with the general spring probe, you can replace any of the probes separately.